The purpose of this project is to enable smart approaches for core THz devices integration by investigation of new methods for packaging at mm-wave and THz frequencies. In this project, we target to develop smart integration of mm-wave and THz devices using laser-machined micro-packages, enabling ‘functional packaging’ at THz range. Core devices to be integrated here will be considering both III-V and silicon THz photonics devices This research work will mainly contribute to answering TERAOPTICS’ research Challenge III, IV and V.
This project targeted outcome is the smart integration of core devices like photomixers and/or detection diodes/harmonic mixing diodes, the building blocks being compatible within several technologies (SiPho, InP, BiCMOS…).
- to RAL (Prof. Peter Huggard), M12 for 2 months, for understanding metal waveguide cavity blocks using CNC technology
- to STM (Daniel Gloria), M18 for 2.5 months, to be trained on STM technology in semiconductor SiGE and SiPho technologies